Electrical power distribution optimized liquid immersion cooling tank with variable flow for high density computer server equipment

ABSTRACT

A liquid immersion cooling system includes a tank defining a tank interior configured to receive electronic components (e.g., servers) and a thermally conductive dielectric liquid to cool the electronic components. The liquid immersion cooling system also includes a power shelf external to the tank interior, where the power shelf includes a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply. The liquid immersion cooling system also includes a DC bus configured to route the DC power supply from the power shelf, into the tank interior, and to the electronic components.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from and the benefit of U.S.Provisional Application Ser. No. 63/185,336, entitled “ELECTRICAL POWERDISTRIBUTION OPTIMIZED LIQUID IMMERSION COOLING TANK WITH VARIABLE FLOWFOR HIGH DENSITY COMPUTER SERVER EQUIPMENT,” filed May 6, 2021, which ishereby incorporated by reference in its entirety for all purposes.

This application also relates to U.S. application Ser. No. 17/491,041,entitled LIQUID IMMERSION COOLING TANK WITH VARIABLE FLOW FOR HIGHDENSITY COMPUTER SERVER EQUIPMENT,” filed Sep. 30, 2021, which is herebyincorporated by reference in its entirety for all purposes.

BACKGROUND OF THE DISCLOSURE

This section is intended to introduce the reader to various aspects ofart that may be related to various aspects of the present disclosure,which are described below. This discussion is believed to be helpful inproviding the reader with background information to facilitate a betterunderstanding of the various aspects of the present disclosure.Accordingly, it should be understood that these statements are to beread in this light, and not as admissions of prior art.

Increasingly, data centers are relied upon for information storage.While providing efficient management of data, data centers have inherentlimitations. Data centers necessarily comprise high numbers of computerservers, said computer servers being delicate instruments which requirecertain atmospheric conditions to operate efficiently. A side effect ofserver density is the generation of heat and the accompanying need todissipate such heat.

The deployment of equipment such as computers and other electricaldevices requires appropriate infrastructure to support it. Inparticular, such equipment requires precise control and regulation ofenvironmental conditions. Cooling requirements for such equipment areimportant with the need to dissipate heat generated by such equipmentbeing a significant limitation in data center design. Systems forcontrolling heat dissipation and/or cooling such equipment arenecessarily important to maintain consistent environmental conditions.

While data centers are often air cooled, an alternate system involves animmersion system. Such immersion systems may be described as involvingan immersion tank comprising a liquid coolant and electronic equipmentimmersed in such liquid coolant.

Conventional tank systems are characterized by tanks which are notinsulated. Moreover, conventional tank systems have only one interiorvolume. The tank comprises a coolant inlet for receiving dielectricliquid coolant within an open interior volume and a coolant outlet forallowing the dielectric liquid coolant to flow from the open interiorvolume.

Servers are typically mounted in an immersion tank such that they formvolumes between each respective vertically oriented rack-mountableserver and the immersion tank wall to permit the flow of dielectricliquid coolant through the plurality of vertically oriented rackmountable servers. Traditional systems also may include alternatingcurrent (AC) power cords routed to individual servers immersed in liquidcooling fluid, typically one or two power cords for each server. For atank containing 48 servers this would equate to 48 or 96 AC power cordsconnecting to the servers within the tank liquid. The abundance of cordsis difficult and cumbersome to handle and organize, and reduces a volumeof the tank devoted to the servers themselves. Further, failures in ACto direct current (DC) conversion occurring at the server can beproblematic because they require that the server be removed from thetank for servicing. Accordingly, it is now recognized that improvedliquid immersion systems and corresponding power distribution assembliesare desired.

SUMMARY

A summary of certain embodiments disclosed herein is set forth below. Itshould be understood that these aspects are presented merely to providethe reader with a brief summary of these certain embodiments and thatthese aspects are not intended to limit the scope of this disclosure.Indeed, this disclosure may encompass a variety of aspects that may notbe set forth below.

A liquid immersion cooling system includes a tank defining a tankinterior configured to receive electronic components (e.g., servers) anda thermally conductive dielectric liquid to cool the electroniccomponents. The liquid immersion cooling system also includes a powershelf external to the tank interior, where the power shelf includes aconverter configured to receive an alternating current (AC) power supplyand convert the AC power supply to a direct current (DC) power supply.The liquid immersion cooling system also includes a DC bus configured toroute the DC power supply from the power shelf, into the tank interior,and to the electronic components.

A liquid immersion cooling system includes a tank defining a tankinterior configured to receive a thermally conductive dielectric liquid,electronic components disposed in the tank interior, and a power shelfexternal to the tank interior. The power shelf includes a converterconfigured to receive an alternating current (AC) power supply andconvert the AC power supply to a direct current (DC) power supply. Theliquid immersion cooling system also includes a DC bus coupled to theconverter and extending into the tank interior, and connectors couplingthe DC bus and the electronic components.

A method of operating a liquid immersion cooling system includescooling, via a thermally conductive dielectric liquid, electroniccomponents disposed in a tank interior of a tank. The method alsoincludes receiving, at a power shelf disposed external to the tankinterior, an alternating current (AC) power supply. The method alsoincludes converting, via a converter of the power shelf, the AC powersupply to a direct current (DC) power supply. The method also includesrouting, via a DC bus coupled to the converter and extending into thetank interior, the DC power supply toward the electronic components.

BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects of this disclosure may be better understood upon readingthe following detailed description and upon reference to the drawings inwhich:

FIG. 1 is a schematic block diagram of a liquid immersion cooling systemhaving a tank defining a tank interior configured to receive electroniccomponents (e.g., servers), and having a power distribution assemblywith one or more power shelves disposed outside of the tank interior, inaccordance with an aspect of the present disclosure;

FIG. 2 is a sectioned plan view illustrating a portion of the liquidimmersion cooling system of FIG. 1, including a number of power shelves,each power shelf being configured to receive dual AC input power supply,in accordance with an aspect of the present disclosure;

FIG. 3 is a schematic illustration of the a power distribution assemblyemploying multiple power shelf assemblies, each including six powershelves (or power shelf modules), for the liquid immersion coolingsystem of FIG. 1, in accordance with an aspect of the presentdisclosure;

FIG. 4 is a schematic plan view of one possible layout of a powerdistribution assembly employed in the liquid immersion cooling system ofFIG. 1, in accordance with an aspect of the present disclosure;

FIG. 5 is a schematic elevation view of a possible layout of a powerdistribution assembly employed in the liquid immersion cooling system ofFIG. 1, in accordance with an aspect of the present disclosure; and

FIG. 6 is a process flow diagram illustrating a method of operating aliquid immersion cooling system including a power distribution assembly,in accordance with an aspect of the present disclosure.

DETAILED DESCRIPTION

One or more specific embodiments of the present disclosure will bedescribed below. These described embodiments are only examples of thepresently disclosed techniques. Additionally, in an effort to provide aconcise description of these embodiments, all features of an actualimplementation may not be described in the specification. It should beappreciated that in the development of any such actual implementation,as in any engineering or design project, numerousimplementation-specific decisions must be made to achieve thedevelopers' specific goals, such as compliance with system-related andbusiness-related constraints, which may vary from one implementation toanother. Moreover, it should be appreciated that such a developmenteffort might be complex and time consuming, but would nevertheless be aroutine undertaking of design, fabrication, and manufacture for those ofordinary skill having the benefit of this disclosure.

When introducing elements of various embodiments of the presentdisclosure, the articles “a,” “an,” and “the” are intended to mean thatthere are one or more of the elements. The terms “comprising,”“including,” and “having” are intended to be inclusive and mean thatthere may be additional elements other than the listed elements.Additionally, it should be understood that references to “oneembodiment” or “an embodiment” of the present disclosure are notintended to be interpreted as excluding the existence of additionalembodiments that also incorporate the recited features.

The present disclosure relates generally to a liquid immersion coolingsystem having a tank defining a tank interior configured to receiveelectronic components (e.g., servers) and a thermally conductivedielectric liquid to cool the electronic components, and having a powerdistribution assembly. More particularly, the present disclosure relatesto one or more power shelves corresponding to the power distributionassembly and disposed external to the tank interior, each of whichhaving one or more converters configured to receive an alternatingcurrent (AC) power supply, convert the AC power supply to direct current(DC) power supply, and output the DC power supply through a DC bus intothe tank interior and toward the electronic components disposed in thetank interior.

For example, the power distribution assembly may include the AC powersupply, the power shelf and corresponding converter, an AC circuitbreaker between the AC power supply and the power shelf, and the DC busextending from the power shelf (e.g., the converter of the power shelf),through an opening in a lid coupled to the tank of the liquid immersioncooling system, through the tank interior, and underneath the electroniccomponents disposed in the tank interior. The DC bus may include a firstrigid portion coupled to the power shelf (e.g., the converter of thepower shelf), a flexible portion coupled to the first rigid portion, afuse disposed in the flexible portion, and a second rigid portioncoupled to the flexible portion. The flexible portion may extend throughthe opening in the lid, and a gasket may be employed to seal (e.g.,fully or partially seal) the opening about the flexible portion of theDC bus. The second rigid portion may extend underneath the electroniccomponents disposed in the tank interior, and blind mate connectors maybe employed to couple the second rigid portion with DC inputs (e.g.,jacks) of the electronic components.

In some embodiments, multiple power shelves may be employed to provideredundancy in case a first power shelf fails (or a component associatedwith the first power shelf, such as the DC bus associated with the firstpower shelf). Additionally or alternatively, multiple power shelves maybe employed to provide enhanced power capacity (e.g., to meet powerdemands associated with the electronic components). Additionally oralternatively, multiple power shelves may be employed to providemultiple DC power supplies at various voltages for compatibility withelectronic components (e.g., servers) having different VDC requirements.Of course, each server may include additional components, such as one ormore transformers, configured to receive the DC power supply at aparticular VDC, such as 12 VDC, and generate various step-down voltagesutilized to power various components of the corresponding server.

As previously described, the flexible portion of the DC bus may bedirected through an opening in the lid coupled to the tank and into thetank interior, and a gasket may be employed to seal (e.g., fully orpartially seal) the opening about the flexible portion of the DC bus.The fuse in the flexible portion of the DC bus may be disposed externalto the tank interior (e.g., above the lid). The gasket may be employedin an effort to block the thermally conductive dielectric liquid fromescaping through the opening. For example, while a liquid level of thethermally conductive dielectric liquid may be below an underside of thelid (e.g., such that a gap exists between the liquid level and theunderside of the lid), capillary action of the thermally conductivedielectric liquid, which may be promoted in certain ambient or operatingconditions, may cause the thermally conductive dielectric liquid totravel up the DC bus toward the opening. The gasket operates to at leastpartially block the thermally conductive dielectric liquid from escapingthrough the opening. Further, in some embodiments, the flexible portionof the DC bus may be disposed at a non-90 degree angle (e.g., an obliqueangle) relative to the underside of the lid, where the angle of theflexible portion of the DC bus may operate to reduce the above-describedcapillary action and, thus, reduce a likelihood that the thermallyconductive dielectric liquid reaches the opening in the lid.

An example of a tank in which the presently disclosed power distributionassembly can be employed is found in U.S. application Ser. No.17/491,041, which is hereby incorporated by reference in its entiretyfor all purposes. For example, the system(s) in U.S. application Ser.No. 17/491,041 include a tank interior configured to receive electroniccomponents (e.g., servers), a control system configured to distribute athermally conductive dielectric liquid from a bottom of the tank andupwardly through the tank interior, a wall disposed external to thetank, and an overflow gap positioned between the tank and the wall andconfigured to receive an overflow of the thermally conductive dielectricliquid, among other features. However, it should be understood that thedisclosed power distribution assembly can be employed in a plethora ofother tank configurations. Indeed, the presently disclosed powerdistribution assembly can be employed in many different types of liquidimmersion cooling tanks, including those that do not employ theabove-described overflow gap. These and other features are described indetail below with reference to the drawings.

Continuing now with the drawings, FIG. 1 is a schematic front view of anembodiment of a liquid immersion cooling system 10 having a tank 12defining a tank interior 14 configured to receive electronic components16 (e.g., servers), and having a power distribution assembly 18 with oneor more power shelves 20 disposed outside of the tank interior 14. Whileonly one power shelf 20 is illustrated in FIG. 1, any number ofinstances of power shelves can be employed in accordance with thepresent disclosure (e.g., for purposes of redundancy, increasedcapacity, variable voltage requirements across the electronic components16, etc.). Embodiments employing multiple power shelves will bedescribed with reference to later drawings. Further, it should be notedthat certain features of the liquid immersion cooling system 10, such asrelative positioning of various components, will be described below withreference to a coordinate system 22 illustrated in FIG. 1. Thecoordinate system 22 includes a vertical axis 24, a longitudinal axis26, and a lateral axis 28, where the vertical axis 24 runs parallel witha Gravity vector 30. However, reference to components of the liquidimmersion cooling system 10 (e.g., including relative positioning ofvarious components) with respect to the coordinate system 22 should beunderstood as exemplary, and other features (e.g., differing positionsand/or orientations of said components) are also possible.

The power distribution assembly 18 in FIG. 1 includes an AC power supplysource 32 that provides an AC power supply 34, and an AC circuit breaker36 that receives the AC power supply 34 as the AC power supply 34 isdirected toward the power shelf 20. The AC circuit breaker 36 mayoperate to protect the system 10 against short circuits and poweroverload. That is, the AC circuit breaker 36 may be actuated in responseto overload or short circuit to block the AC power supply 34 fromreaching the power shelf 20. Additionally or alternatively, in someembodiments, the AC circuit breaker 36 may be manually actuatable toblock the AC power supply 34 from reaching the power shelf 20. In someembodiments, a switch may be employed in lieu of, or in addition to, theAC circuit breaker 36.

The power shelf 20 in FIG. 1 includes a converter 35 configured toreceive the AC power supply 34 and convert the AC power supply 34 to adirect current (DC) power supply 38. As previously described, the powershelf 20 and corresponding converter 35 are disposed in an external area39 outside of the tank interior 14 defined by the tank 12. A DC bus 40may guide the DC power supply 38 from the power shelf 20 (e.g., from theconverter 35) and toward the tank 12. The DC bus 40 may extend throughan opening 42 in a lid 44 coupled to, or forming a part of, the tank 12.

As previously described, the tank interior 14 defined by the tank 12 ofthe liquid immersion cooling system 10 may receive a thermallyconductive dielectric liquid 45 such that the electronic components 16(e.g., servers) are immersed or submerged in the thermally conductivedielectric liquid 45. A gasket 46 may be employed to seal the opening 42about the DC bus 40, in an effort to block the thermally conductivedielectric liquid 45 from escaping the tank interior 14 through theopening 42. Indeed, while a liquid level 48 of the thermally conductivedielectric liquid 45 may be below an underside of the lid 44, capillaryaction may cause the thermally conductive dielectric liquid 45 to travelalong the DC bus 40 and toward the opening 42. Accordingly, the gasket46 may be employed at the opening 42 to block the thermally conductivedielectric liquid 45 from escaping through the opening 42.

In some embodiments, the gasket 46 may only partially seal the opening42. Further, the capillary action of the thermally conductive dielectricliquid 45 may be increased during certain ambient and/or operatingconditions. Accordingly, to further reduce a likelihood of the thermallyconductive dielectric liquid 45 from escaping through the opening 42,the DC bus 40 may be oriented such that it forms an oblique angle 49with the lid 44 (e.g., the underside of the lid 44). Put differently,the DC bus 40 may form the oblique angle 49 such that it does not runparallel to the vertical axis 24 (or the Gravity vector 30) immediatelybelow the lid 44. The oblique angle 49 may operate to reduce thecapillary action of the thermally conductive dielectric liquid 45, whichreduces a likelihood that the thermally conductive dielectric liquid 45escapes through the opening 42.

As shown in FIG. 1, the DC bus 40 may extend through the thermallyconductive dielectric liquid 45 in the tank interior 14 and underneaththe electronic components 16 (e.g., servers). That is, relative to thevertical axis 24, the electronic components 16 (e.g., disposed in a rowextending along the longitudinal axis 26) may be disposed above aportion of the DC bus 40 extending underneath the electronic components16. A number of blind mate connectors 50 may be employed to couple theportion of the DC bus 40 underneath the electronic components 16 withthe DC inputs 52 (e.g., DC jacks) in each of the electronic components16. While FIG. 1 illustrates the DC bus 40 extending from the powershelf 20 (e.g., the converter 35 of the power shelf 20) and to the blindmate connectors 50 coupled to the DC bus 40 and the DC jacks 52 of theelectronic components 16, it should be understood, as described indetail with reference to later drawings, that the DC bus 40 may includea number of various portions (e.g., rigid portions, flexible portions,etc.) and components (e.g., one or more fuses).

In general, the power shelf 20 disposed external to the tank interior14, as shown in the embodiment illustrated in FIG. 1, may improve anease of manufacturing, assembling, repairing, and maintaining the liquidimmersion cooling system 10. Indeed, AC-to-DC conversion may represent aprevalent fault mode in liquid immersion cooling, and in traditionalembodiments, faults in AC-to-DC conversion occurring at the server mayrequire that the server is taken off-line, removed from system,replaced, and repaired. Further, power cord management associated withtraditional systems employing AC-to-DC conversion at the servers can becumbersome and disorganized.

FIG. 2 is a sectioned plan view illustrating a portion of the liquidimmersion cooling system 10 of FIG. 1, including a number of powershelves, each power shelf being configured to receive dual AC inputpower supply. For example, as previously described, the liquid immersioncooling system 10 includes the tank 12 defining the tank interior 14,and the lid 44 coupled to (or forming a part of) the tank 12. Further,the system 10 includes the AC power supply source 32.

In the illustrated embodiment, the AC power supply source 32 providesthe AC power supply 34 toward a number of AC circuit breakers 36 a, 36b, 36 c, 136 a, 136 b, 136 c, 236 a, 236 b, 236 c, 336 a, 336 b, 336 c,436 a, 436 b, 436 c, 536 a, 536 b, and 536 c mounted on a DIN rail 80.For example, AC circuit breakers 36 a and 36 b correspond to the powershelf 20 (or power shelf module). Two spare AC circuit breakers 36 calso correspond to the power shelf 20. The power shelf 20 is configuredto receive dual AC input power supplies 34 a, 34 b. The dual AC inputpower supplies 34 a, 34 b may be provided for redundancy and/or variablepower capacity control. In the illustrated embodiment, the system 10includes six power shelves, including the first power shelf 20 (or firstpower shelf module), a second power shelf 120 (or second power shelfmodule), a third power shelf 220 (or third power shelf module), a fourthpower shelf 320 (or fourth power shelf module), a fifth power shelf 420(or fifth power shelf module), and a sixth power shelf 520 (or sixthpower shelf module). In some embodiments, the first power shelf 20, thesecond power shelf 120, the third power shelf 220, the fourth powershelf 320, the fifth power shelf 420, and the sixth power shelf 520 maybe integrated in a common housing referred to as a power shelf housing.Thus, in certain instances, the first, second, third, fourth, fifth, andsixth modules 20, 120, 220, 320, 420, 520 may be collectively a powershelf. Additionally or alternatively, the first, second, third, fourth,fifth, and sixth power shelves 20, 120, 220, 320, 420, 520 (or powershelf modules) may collectively be referred to as a power shelfassembly.

Like the first power shelf 20 configured to receive the dual AC inputpower supplies 34 a, 34 b, the second power shelf 120 may be configuredto receive dual AC input power supplies 134 a, 134 b (e.g., from circuitbreakers 136 a, 136 b), the third power shelf 220 may be configured toreceive dual AC input power supplies 234 a, 234 b (e.g., from circuitbreakers 236 a, 236 b), and so on and so forth. Further, each powershelf includes a dedicated converter. Indeed, the first power shelf 20includes the first converter 35, the second power shelf 120 includes asecond converter 135, the third power shelf 220 includes a thirdconverter 235, the fourth power shelf 320 includes a fourth converter335, the fifth power shelf 420 includes a fifth converter 435, and thesixth power shelf 520 includes a sixth converter 535.

The first power shelf 20 and the second power shelf 120 may share the DCbus 40, the third power shelf 220 and the fourth power shelf 320 mayshare a DC bus 140, and the fifth power shelf 420 and the sixth powershelf 520 may share a DC bus 240. As shown, each DC bus 40, 140, 240 mayinclude multiple portions. For example, the DC bus 40 includes apositive line 82 (or positive bus bar) and a negative line 83 (ornegative bus bar) corresponding to the first power shelf 20, and anadditional positive line 84 (or additional positive bus bar) andadditional negative line 85 (or additional negative bus bar)corresponding to the second power shelf 120. The positive line 82 andthe negative line 83, for example, may be physically separate (e.g.,separate bus bars) or contained within a single component of the DC bus40. Further, the DC bus 140 includes a positive line 182 (or positivebus bar) and a negative line 183 (or negative bus bar) corresponding tothe third power shelf 220, and an additional positive line 184 (oradditional positive bus bar) and additional negative line 185 (oradditional negative bus bar) corresponding to the fourth power shelf320. Further, the DC bus 240 includes a positive line 282 (or positivebus bar) and a negative line 183 (or negative bus bar) corresponding tothe fifth power shelf 420, and an additional positive line 284 (oradditional positive bus bar) and additional negative line 285 (oradditional negative bus bar) corresponding to the sixth power shelf 520.The positive line 82 corresponding to the first power shelf 20 and theadditional positive line 84 corresponding to the second power shelf 120may be joined (e.g., in a single positive bus bar), and the negativeline 83 corresponding to the first power shelf 20 and the negative line85 corresponding to the second power shelf 120 may be joined (e.g., in asingle negative bus bar). Alternatively, the above-described lines maybe separate and included in separate bus bar portions.

Further, each DC bus 40, 140, 240 includes various rigid and flexibleportions. For example, the DC bus 40 includes a first rigid portion 86and a flexible portion 87 (e.g., copper flexible portion) having a firstend coupled to the rigid portion 86 and having a second end coupled toan additional (or second) rigid portion 88. As shown, the DC bus 40includes a fuse 90 disposed in the flexible portion 87 and above theopening 42 in the lid 44 coupled to (or forming a part of) the tank 12.In this way, the flexible portion 87 extends through the opening 42,which is sealed by the gasket 46 as previously described. The flexibleportion 87 transitions to the second rigid portion 88 as shown.

The DC bus 140 and the DC bus 240 may include the same or similarfeatures as noted above with respect to the DC bus 40. Indeed, the DCbus 140 includes a first rigid portion 186, a flexible portion 187coupled to the first rigid portion 186, and a second rigid portion 188coupled to the flexible portion 187. The flexible portion 187 includes afuse 190 and extends through an opening 142 in the lid 44, where theopening 142 is sealed by a gasket 146. Further, the DC bus 240 includesa first rigid portion 286, a flexible portion 287 coupled to the firstrigid portion 286, and a second rigid portion 288 coupled to theflexible portion 187. The flexible portion 287 includes a fuse 290 andextends through an opening 242 in the lid 33, where the opening 242 issealed by a gasket 246. The second rigid portion 88 of the DC bus 40 iscoupled to, or includes, a rigid bar portion 94 (which may include afirst bar, such as a positive bar, and a second bar, such as a negativebar) extending along a bottom of the tank 14, the second rigid portion188 of the DC bus 140 is coupled to, or includes, a rigid bar portion194 (which may include a first bar, such as a positive bar, and a secondbar, such as a negative bar) extending along a bottom of the tankinterior 14, and the DC bus 240 is coupled to, or includes, a rigid barportion 294 (which may include a first bar, such as a positive bar, anda second bar, such as a negative bar) extending along a bottom of thetank interior 14. A voltage difference between the positive and negativelines (or bars) may correspond to a total voltage (or delta voltage)provided to the electronic components (e.g., computer servers). Forexample, a positive line may carry +24 VDC and a negative line may carry−24 VDC, such that the total voltage (or delta voltage) is 48 VDC. Ofcourse, other voltages are also possible and may be dependent on powerdemand and desired power capacity, desired redundancy features, and/ordesired compatibility with the electronic components. As previouslydescribed, blind mate connectors (not shown, but illustrated in FIG. 1)may be employed to couple the rigid bar portions 94, 194, 294 to variouselectronic components (not shown, but illustrate in FIG. 1), such ascomputer servers, disposed in the tank interior 14. As previouslydescribed, each electronic may couple to one, or two, or all three of94, 194, 294, depending on desired power features relating toredundancy, capacity, and/or compatibility.

The illustrated arrangement in FIG. 2 can be employed in a number ofways. For example, the multiple power shelves 20, 120, 220, 320, 420,520 and corresponding features may be employed to improve a powercapacity (e.g., meet a power demand) corresponding with the liquidimmersion cooling system 10, to provide redundancy in the case certainones of the power shelves 20, 120, 220, 320, 420, 520 (or correspondingcomponents) fail, and/or to provide DC power in various voltages (e.g.,12 VDC, 48-54 VDC, etc.) to various electronic components havingdifferent DC voltage power requirements. In other words, the converters35, 135, 235, 335, 435, 535 may be configured to output DC powersupplies having the same voltage, or certain ones of the converters 35,135, 235, 335, 435, 535 may be configured to output DC power supplieshaving differing voltages. Accordingly, it should be understood that therigid bar portions 94, 194, 294 of the DC busses 40, 140, 240,respectively, may be configured to couple (e.g., via blind mateconnectors) to the same electronic components or to different groupingsof the electronic components, as understood by one of ordinary skill inthe art.

In some embodiments, a controller 97 is employed and includes aprocessor 98 and a memory 99. The processor 98 is configured to executeinstructions stored on the memory 99 to perform various control actionscorresponding to the above-described components and functionality of theliquid immersion cooling system 10. In some embodiments, the controller97 is configured to perform various control actions based on datafeedback received from a sensor or sensor assembly 100, such as a powersensor or power sensor assembly. For example, the controller 97 mayoperate to connect and/or disconnect various ones of the DC busses 40,140, 240 from various ones or groupings of the electronic components(e.g., shown in FIG. 1 and denoted with reference numeral 16) based onlost or available power, based on power compatibility, etc.

It should be noted that the features described above with respect toFIG. 2 are merely provided as examples of various ways a powerdistribution assembly in accordance with the present disclosure can beemployed in the liquid immersion cooling system 10. Other configurationsare also possible. For example, in an embodiment, the DC bus 40 in FIG.2 may be configured to provide a DC power supply to a first tank, the DCbus 140 in FIG. 2 may be configured to provide a DC power supply to asecond tank, and the DC bus 240 in FIG. 2 may be configured to provide aDC power supply to a third tank. In general, the disclosed embodimentsinclude improvements over traditional systems and methods at leastbecause AC-to-DC power conversion is implemented in the external area 39(i.e., outside the tank interior 14 of the tank 12) instead of withinthe electronic components (e.g., computer servers), which reduces ACcord management and improves ease of manufacturing, assembly,maintenance, and repair of the system 10, as previously described.

FIG. 3 is a schematic illustration of an embodiment of the powerdistribution assembly 18 employing multiple power shelf assemblies, eachincluding six power shelves (or power shelf modules), for the liquidimmersion cooling system 10 of FIG. 1. In the illustrated embodiment,the power distribution assembly 18 includes a first power rack 600including a number of power shelf assemblies 700, a second power rack602 including a number of power shelf assemblies 702, and a third powerrack 604 including a number of power shelf assemblies 704. Each powershelf assembly 700 of the first power rack 600 may include the firstpower shelf module 20, the second power shelf module 120, the thirdpower shelf module 220, the fourth power shelf module 320, the fifthpower shelf module 420, and the sixth power shelf module 520. Likewise,each power shelf assembly 702 of the second power rack 602 and eachpower shelf assembly 704 of the third power rack 604 may include thepower shelf modules 20, 120, 220, 320, 420, 520. A first DC bus assembly800 may be provided for the first power rack 600, a second DC busassembly 802 may be provided for the second power rack 602, and a thirdDC bus assembly 804 may be provided for the third power rack 804. Aspreviously described, each of the first, second, and third DC busassemblies 800, 802, 804 may include the first rigid portion(s)discussed with respect to FIG. 2, the flexible portion(s) discussed withrespect to FIG. 2, and the second rigid portion(s) discussed withrespect to FIG. 2. Further, fuses 900, 902, 904 may be employed in theflexible portion(s) of the DC bus assemblies 800, 802, 804,respectively. The DIN rail(s) 80, including AC circuit breakers, is alsoshown in FIG. 3.

FIG. 4 is a schematic plan view of one possible layout of an embodimentof the power distribution assembly 18 employed in the liquid immersioncooling system 10 of FIG. 1. In the illustrated embodiment, the powerdistribution assembly 18 provides DC power supply to first electroniccomponents 16 a disposed in a first tank interior 14 a of a first tank12 a, and to second electronic components 16 b disposed in a second tankinterior 14 b of a second tank 12 b. A first DC bus assembly 40 a of thepower distribution assembly 18 extends through an opening 42 a in afirst lid 44 a of the first tank 12 a, and a second DC bus assembly 40 bof the power distribution assembly 18 extends through an opening 42 b ina second lid 44 b of the second tank 12 b. The first DC bus assembly 40a may include three DC bus bar portions 94 a, 194 a, 294 a extending inthe tank interior 14 a of the first tank 12 a, and the second DC busassembly 40 b may include three DC bus bar portions 94 b, 194 b, 294 bextending into the tank interior 14 b of the second tank 12 b. Aspreviously described, an external portion 950 of the power distributionassembly 18, in the external area 39 outside of the tank interiors 14 a,14 b, may receive AC power and convert the AC power to DC power. The DCpower is then routed to the electronic components 16 a, 16 b in the tankinteriors 14 a, 14 b, as previously described.

FIG. 5 is a schematic elevation view of a possible layout of the powerdistribution assembly 18 employed in the liquid immersion cooling system10 of FIG. 1. The layout in FIG. 5 may be the same as, or similar to,the layout in FIG. 4. As is the case in FIG. 4, FIG. 5 includes thefirst tank 12 a defining the first tank interior 14 a and the secondtank 12 b defining the second tank interior 14 b. Further, the powerdistribution assembly 18 includes the external portion 950 disposed inthe external environment 39 outside of the tank interiors 14 a, 14 b,where the AC-to-DC power conversion occurs in the external portion 950.The DC bus assemblies 40 a, 40 b route the DC power supply through oneor more openings 42 a, 42 b in the lids 44 a, 44 b of the tanks 12 a, 12b. As previously described, the three DC bus bar portions 94 a, 194 a,294 a may be employed in the first tank 12 a and the three DC bus bar 94b, 194 b, 294 b may be employed in the second tank 12 b. Any of thefeatures illustrated in FIGS. 1-3 can be employed in the embodimentsillustrated in FIGS. 4 and 5. In general, in each of the systemillustrated in FIGS. 1-5, AC-to-DC power conversion is completed outsideof the various tank interiors (e.g., in the external environment 39),and the DC power supply is routed into the various tank interiors andprovided to the electronic components (e.g., computer servers) therein.

FIG. 6 is a process flow diagram illustrating a method 1000 of operatinga liquid immersion cooling system including a power distributionassembly. In the illustrated embodiment, the method 1000 includescooling (block 1002), via a thermally conductive dielectric liquid,electronic components disposed in a tank interior of a tank of theliquid immersion cooling system.

Further, the method 1000 includes receiving (block 1004), at a powershelf disposed external to the tank interior, an alternating current(AC) power supply. As previously described, an AC circuit breaker may bedisposed upstream of the power shelf and configured to block the ACpower supply from reaching the power shelf in the event of a shortcircuit or overload. Further, as previously described, dual AC powersupplies from the AC power source may be provided to the power shelf incertain embodiments.

Further, the method 1000 includes converting (block 1006), via aconverter of the power shelf, the AC power supply to a direct current(DC) power supply. The DC power supply may be, for example, 12 VDC,48-54 VDC, or any other VDC suitable for, and compatible with, theelectronic components ultimately receiving the DC power supply. Themethod 1000 includes routing (block 1008), via a DC bus coupled to theconverter and extending into the tank interior, the DC power supplytoward the electronic components. The DC bus may include, for example, afirst rigid portion extending from the power shelf, a flexible portioncoupled to the first rigid portion, including a fuse therein, andextending through a lid of the tank, and a second rigid portion coupledto the flexible portion (e.g., within the tank interior). The rigidportion may extend underneath the electronic components and/or along abottom of the tank interior.

The method 1000 also includes inputting (block 1010), via blind mateconnectors coupled to the DC bus and to the electronic components, theDC power supply to the electronic components. For example, eachelectronic component may include a DC jack coupled to a correspondingone of the blind mate connectors.

Other steps in the method 1000 are also possible. For example, aspreviously described, multiple power shelves and multiple DC busses maybe employed. Indeed, in some embodiments, a first DC bus and a second DCbus may be employed for purposes of redundancy in the event one powershelf (or corresponding components) fails. Additionally oralternatively, one DC bus may provide a DC power supply to a first groupof electronic components at a first VDC (e.g., 12 VDC), while another DCbus may provide a DC power supply to a second group of electroniccomponents at a second VDC (e.g., 48-54 VDC). The method 1000illustrated in FIG. 6 is provided merely as an example, and other methodsteps and/or functionality described with respect to the componentryillustrated in FIGS. 1-5 are also possible.

Technical benefits associated with the presently disclosed immersioncooling systems and methods include improved temperature control ofelectronic components (e.g., computer servers) via heat exchange with athermally conductive dielectric liquid, improved flow control of thethermally conductive dielectric liquid, reduced power consumption of thesystem, reduced complexity and cost of the system, and the like relativeto conventional embodiments.

The present disclosure is not to be limited in scope by the specificembodiments described herein. Indeed, various modifications of thedisclosure in addition to those described herein will become apparent tothose skilled in the art from the foregoing description. Suchmodifications are intended to fall within the scope of the appendedclaims.

While only certain features and embodiments of the disclosure have beenillustrated and described, many modifications and changes may occur tothose skilled in the art, such as variations in sizes, dimensions,structures, shapes and proportions of the various elements, values ofparameters including temperatures and pressures, mounting arrangements,use of materials, colors, orientations, etc., without materiallydeparting from the novel teachings and advantages of the subject matterrecited in the claims. The order or sequence of any process or methodsteps may be varied or re-sequenced according to alternativeembodiments. It is, therefore, to be understood that the appended claimsare intended to cover all such modifications and changes as fall withinthe true spirit of the disclosure. Furthermore, in an effort to providea concise description of the exemplary embodiments, all features of anactual implementation may not have been described, such as thoseunrelated to the presently contemplated best mode of carrying out thedisclosure, or those unrelated to enabling the claimed disclosure. Itshould be appreciated that in the development of any such actualimplementation, as in any engineering or design project, numerousimplementation specific decisions may be made. Such a development effortmight be complex and time consuming, but would nevertheless be a routineundertaking of design, fabrication, and manufacture for those ofordinary skill having the benefit of this disclosure, without undueexperimentation.

The techniques presented and claimed herein are referenced and appliedto material objects and concrete examples of a practical nature thatdemonstrably improve the present technical field and, as such, are notabstract, intangible or purely theoretical. Further, if any claimsappended to the end of this specification contain one or more elementsdesignated as “means for [perform]ing [a function] . . . ” or “step for[perform]ing [a function]. . . ,” it is intended that such elements areto be interpreted under 35 U.S.C. 112(f). However, for any claimscontaining elements designated in any other manner, it is intended thatsuch elements are not to be interpreted under 35 U.S.C. 112(f).

All patents, applications, publications, test methods, literature, andother materials cited herein are hereby incorporated by reference.

We claim:
 1. A liquid immersion cooling system, comprising: a tankdefining a tank interior configured to receive a plurality of electroniccomponents and a thermally conductive dielectric liquid to cool theplurality of electronic components; a power shelf external to the tankinterior, wherein the power shelf comprises a converter configured toreceive an alternating current (AC) power supply and convert the ACpower supply to a direct current (DC) power supply; and a DC busconfigured to route the DC power supply from the power shelf, into thetank interior, and to the plurality of electronic components.
 2. Theliquid immersion cooling system of claim 1, comprising: an additionalpower shelf external to the tank interior, wherein the additional powershelf comprises an additional converter configured to receive the ACpower supply and covert the AC power supply to an additional DC powersupply; and an additional DC bus configured to route the additional DCpower supply from the power shelf, into the tank interior, and to theplurality of electronic components or an additional plurality ofelectronic components.
 3. The liquid immersion cooling system of claim2, wherein: the converter is configured to convert the AC power supplyto the DC power supply such that the DC power supply includes a firstvoltage; and the additional converter is configured to convert the ACpower supply to the additional DC power supply such that the additionalDC power supply includes a second voltage different than the firstvoltage.
 4. The liquid immersion cooling system of claim 2, wherein: theconverter is configured to convert the AC power supply to the DC powersupply such that the DC power supply includes a first voltage; and theadditional converter is configured to convert the AC power supply to theadditional DC power supply such that the additional DC power supplyincludes a second voltage substantially equal to the first voltage. 5.The liquid immersion cooling system of claim 1, wherein the DC buscomprises: a first rigid portion coupled to the power shelf; a flexibleportion having a first end coupled to the first rigid portion, amid-section having a fuse therein, and a second end opposing the firstend; and a second rigid portion coupled to the second end of theflexible portion and disposed in the tank interior.
 6. The liquidimmersion cooling system of claim 5, comprising a lid extending over thetank interior and coupled to the tank, wherein the flexible portion ofthe DC bus extends through an opening in the lid, and the fuse isdisposed external to the tank interior.
 7. The liquid immersion coolingsystem of claim 5, comprising a plurality of blind mate connectorsconfigured to: interface the second rigid portion of the DC bus with theplurality of electronic components; and distribute the DC power supplyfrom the second rigid portion of the DC bus to the plurality ofelectronic components.
 8. The liquid immersion cooling system of claim1, comprising: a lid extending over the tank interior and coupled to thetank; an opening in the lid, wherein the DC bus extends through theopening; and a gasket that seals the opening around the DC bus.
 9. Theliquid immersion cooling system of claim 1, comprising an AC powercircuit breaker coupled to an AC power supply source configured toprovide the AC power supply to the converter of the power shelf.
 10. Theliquid immersion cooling system of claim 1, wherein each electroniccomponent of the plurality of electronic components comprises a DC powerjack configured to receive the DC power supply from the DC bus.
 11. Aliquid immersion cooling system, comprising: a tank defining a tankinterior configured to receive a thermally conductive dielectric liquid;a plurality of electronic components disposed in the tank interior; apower shelf external to the tank interior, wherein the power shelfcomprises a converter configured to receive an alternating current (AC)power supply and convert the AC power supply to a direct current (DC)power supply; a DC bus coupled to the converter and extending into thetank interior; and a plurality of connectors coupling the DC bus and theplurality of electronic components.
 12. The liquid immersion coolingsystem of claim 11, comprising a lid engaged with the tank, wherein: theplurality of electronic components comprises a plurality of upper endsfacing the lid and a plurality of lower ends opposing the plurality ofupper ends; the DC bus extends through an opening in the lid and towardthe plurality of lower ends of the plurality of electronic components;and the plurality of connectors comprises a plurality of blind mateconnectors coupling the DC bus and the plurality of lower ends of theplurality of electronic components.
 13. The liquid immersion coolingsystem of claim 11, comprising a lid engaged with the tank, an openingin the lid, and a gasket configured to interface with the opening,wherein: the DC bus extends through an opening in the lid; and thegasket seals the opening in the lid around the DC bus.
 14. The liquidimmersion cooling system of claim 13, wherein the DC bus comprises: afirst rigid portion coupled to the converter and disposed outside of thetank interior; a flexible portion having a first end coupled to thefirst rigid portion, a mid-section having a fuse therein, and a secondend opposing the first end, wherein the flexible portion extends throughthe opening in the lid and the gasket seals the opening in the lidaround the flexible portion; and a second rigid portion coupled to thesecond end of the flexible portion and disposed in the tank interior.15. The liquid immersion cooling system of claim 11, comprising: anadditional power shelf external to the tank interior, wherein theadditional power shelf comprises an additional converter configured toreceive the AC power supply and covert the AC power supply to anadditional DC power supply; an additional DC bus coupled to theadditional converter and extending into the tank interior; and anadditional plurality of connectors coupling the additional DC bus andthe plurality of electronic components or an additional plurality ofelectronic components.
 16. A method of operating a liquid immersioncooling system, the method comprising: cooling, via a thermallyconductive dielectric liquid, a plurality of electronic componentsdisposed in a tank interior of a tank; receiving, at a power shelfdisposed external to the tank interior, an alternating current (AC)power supply; converting, via a converter of the power shelf, the ACpower supply to a direct current (DC) power supply; and routing, via aDC bus coupled to the converter and extending into the tank interior,the DC power supply toward the plurality of electronic components. 17.The method of claim 16, comprising inputting, via blind mate connectorscoupled to the DC bus and to the plurality of electronic components, theDC power supply to the plurality of electronic components.
 18. Themethod of claim 16, comprising: cooling, via the thermally conductivedielectric liquid, an additional plurality of electronic componentsdisposed in the tank interior of the tank; receiving, at an additionalpower shelf disposed external to the tank interior, the AC power supply;converting, via an additional converter of the additional power shelf,the AC power supply to an additional DC power supply; and routing, viaan additional DC bus coupled to the converter and extending into thetank interior, the additional DC power supply toward the additionalplurality of electronic components.
 19. The method of claim 18,comprising: converting, via the converter of the power shelf, the ACpower supply to the direct current (DC) power supply such that the DCpower supply includes a first voltage; and converting, via theadditional converter of the additional power shelf, the AC power supplyto the additional DC power supply such that the additional DC powersupply includes a second voltage different than the first voltage. 20.The method of claim 16, comprising sealing an opening in a lid of thetank via a gasket such that the DC bus extends through the opening andthe opening is sealed by the gasket about the DC bus.